[dpdk-dev] [PATCH V3 0/4] bonding: fixes and enhancements

[Eric Kinzie]

These are bug fixes and some small enhancements to allow bonding
to work with external control (teamd). Please consider integrating
these into DPDK 2.2

Changes in v2:
- remove "bond: handle slaves with fewer queues than bonding device"
- remove "bond: per-slave intermediate rx ring"

Changes in v3:
This version has only fixes.  Patches with new functionality have been
removed and will be submitted separately.
- remove "bond mode 4: allow external state machine"
- remove "bond: use existing enslaved device queues"

Eric Kinzie (4):
  bond mode 4: copy entire config structure
  bond mode 4: do not ignore multicast
  bond: active slaves with no primary
  bond: do not activate slave twice

 app/test/test_link_bonding_mode4.c        |  7 +++++--
 drivers/net/bonding/rte_eth_bond_8023ad.c |  1 +
 drivers/net/bonding/rte_eth_bond_api.c    | 13 +++++++++++--
 drivers/net/bonding/rte_eth_bond_pmd.c    |  1 +
 4 files changed, 18 insertions(+), 4 deletions(-)

-- 
2.1.4