[dpdk-dev] [PATCH V3 0/4] bonding: fixes and enhancements
Bruce Richardson
bruce.richardson at intel.com
Thu Mar 10 16:41:41 CET 2016
On Tue, Mar 01, 2016 at 09:31:58AM -0800, Eric Kinzie wrote:
> These are bug fixes and some small enhancements to allow bonding
> to work with external control (teamd). Please consider integrating
> these into DPDK 2.2
>
> Changes in v2:
> - remove "bond: handle slaves with fewer queues than bonding device"
> - remove "bond: per-slave intermediate rx ring"
>
> Changes in v3:
> This version has only fixes. Patches with new functionality have been
> removed and will be submitted separately.
> - remove "bond mode 4: allow external state machine"
> - remove "bond: use existing enslaved device queues"
>
> Eric Kinzie (4):
> bond mode 4: copy entire config structure
> bond mode 4: do not ignore multicast
> bond: active slaves with no primary
> bond: do not activate slave twice
>
> app/test/test_link_bonding_mode4.c | 7 +++++--
> drivers/net/bonding/rte_eth_bond_8023ad.c | 1 +
> drivers/net/bonding/rte_eth_bond_api.c | 13 +++++++++++--
> drivers/net/bonding/rte_eth_bond_pmd.c | 1 +
> 4 files changed, 18 insertions(+), 4 deletions(-)
>
> --
> 2.1.4
>
Applied to dpdk-next-net/rel_16_04
/Bruce
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