[PATCH v2] net/bonding: rename bonded to bonding

[Ferruh Yigit]

On 9/21/2023 7:10 AM, Chaoyong He wrote:
> From: Long Wu <long.wu at corigine.com>
> 
> DPDK bonding PMD mixing use 'bonded' and 'bonding' currently, this
> patch replaces the usage of the word 'bonded' with more appropriate
> word 'bonding' in bonding PMD as well as in its docs. Also the test
> app and testpmd were modified to use the new wording.
> 
> In addition to grammar requirements, we should still use bonded,
> and in other cases, we should use bonding.
> 
> Signed-off-by: Long Wu <long.wu at corigine.com>
> Reviewed-by: Chaoyong He <chaoyong.he at corigine.com>
> Reviewed-by: James Hershaw <james.hershaw at corigine.com>
> ---
> v2:
> * Rebase to the latest commits.

Thanks for the rebase.

Acked-by: Ferruh Yigit <ferruh.yigit at amd.com>

Applied to dpdk-next-net/main, thanks.

<...>

> @@ -505,17 +505,17 @@ Testpmd driver specific commands
>  
>  Some bonding driver specific features are integrated in testpmd.
>  
> -create bonded device
> +create bonding device
>  ~~~~~~~~~~~~~~~~~~~~
>  

This gives warning, will fix while merging.

link_bonding_poll_mode_drv_lib.rst:509: WARNING: Title underline too short.