[dpdk-dev] [PATCH v3] app/testpmd: add cmdline to show LACP bonding info

[Ferruh Yigit]

On 10/11/2021 9:17 AM, Li, Xiaoyun wrote:
>> -----Original Message-----
>> From: Min Hu (Connor) <humin29 at huawei.com>
>> Sent: Friday, September 24, 2021 17:57
>> To: dev at dpdk.org
>> Cc: Yigit, Ferruh <ferruh.yigit at intel.com>; Li, Xiaoyun <xiaoyun.li at intel.com>
>> Subject: [PATCH v3] app/testpmd: add cmdline to show LACP bonding info
>>
>> From: Chengchang Tang <tangchengchang at huawei.com>
>>
>> Add a new cmdline to help diagnostic the bonding mode 4 in testpmd.
>>
>> Show the lacp information about the bonded device and its slaves:
>> show bonding lacp info <bonded device port_id>
>>
>> Signed-off-by: Chengchang Tang <tangchengchang at huawei.com>
>> Signed-off-by: Min Hu(Connor) <humin29 at huawei.com>
>> ---
>> v3:
>> * fix state show.
>>
>> v2:
>> * same patch with v1.
>> ---
>>   app/test-pmd/cmdline.c                      | 184 ++++++++++++++++++++
>>   doc/guides/testpmd_app_ug/testpmd_funcs.rst |   6 +
>>   2 files changed, 190 insertions(+)
> 
> Acked-by: Xiaoyun Li <xiaoyun.li at intel.com>
> 

Applied to dpdk-next-net/main, thanks.