[dpdk-dev] [PATCH v3] app/testpmd: add cmdline to show LACP bonding info

[Li, Xiaoyun]

> -----Original Message-----
> From: Min Hu (Connor) <humin29 at huawei.com>
> Sent: Friday, September 24, 2021 17:57
> To: dev at dpdk.org
> Cc: Yigit, Ferruh <ferruh.yigit at intel.com>; Li, Xiaoyun <xiaoyun.li at intel.com>
> Subject: [PATCH v3] app/testpmd: add cmdline to show LACP bonding info
> 
> From: Chengchang Tang <tangchengchang at huawei.com>
> 
> Add a new cmdline to help diagnostic the bonding mode 4 in testpmd.
> 
> Show the lacp information about the bonded device and its slaves:
> show bonding lacp info <bonded device port_id>
> 
> Signed-off-by: Chengchang Tang <tangchengchang at huawei.com>
> Signed-off-by: Min Hu(Connor) <humin29 at huawei.com>
> ---
> v3:
> * fix state show.
> 
> v2:
> * same patch with v1.
> ---
>  app/test-pmd/cmdline.c                      | 184 ++++++++++++++++++++
>  doc/guides/testpmd_app_ug/testpmd_funcs.rst |   6 +
>  2 files changed, 190 insertions(+)

Acked-by: Xiaoyun Li <xiaoyun.li at intel.com>